Reading9 resources
Surveys & Articles
AI for Chip surveys, engineering case studies, and technical articles.
- Exploring the Agentic Frontier of Verilog Code Generation (2026) — Compares prompt structures, tools, and agent wrappers under controlled conditions on CVDP, analyzing failure modes such as tool-output interpretation and crashes.
- Human-Centered Agentic AI Workflows for RTL Verification — Siemens explains the division of work among engineers, agents, and deterministic tools in RTL verification.
- LLM for EDA in Front-End Design (2026) — Discusses LLM capabilities and limitations in specification understanding, HDL, testbenches, and high-level synthesis.
- LLMs for EDA: A Survey (2025) — Surveys EDA tasks, model adaptation, and evaluation methods for LLMs.
- Loop Engineering for Chip Design (2026) — Agentrys’ XiangShan optimization case study connects workloads, microarchitecture parameters, correctness checks, and physical design feedback.
- Microsoft Discovery — Learning Chip Design (2026) — Describes using Discovery to progress from specifications and RTL to OpenROAD physical layout, with experiments in timing and power optimization.
- Report for NSF Workshop on AI for EDA (2026) — Covers physical design, synthesis, verification, and AI tools, and discusses data and computing infrastructure.
- The Dawn of Agentic EDA (2025–2026) — Surveys agent workflows and cross-stage feedback from RTL and verification through physical design.
- Thermonat Thermal Modeling (2026) — IBM and Ansys/Synopsys combine atomistic thermal data, reduced-order models, and a Fourier neural operator in a DARPA project to connect transistor thermal behavior with chip design.